Sealant «Elasil 137-185»
(TS 6-02-1-346-84)
(Heat conducting)
«Elasil 137-1852 is a 2-part pasty composition based on low molecular rubber, and fillers curing when mixed with vulcanization catalyst (K-18 or K-68) with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity within 24 hours.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | grey |
| 2 | Dynamic viscosity at 20оС | 600-800 Pa.s |
| 3 | Skinning time at 20оС | < 3h |
| 4 | Tensile strengthBond strengths with metal at shear | >1.4 MPa |
| 5 | Dielectric factor at 20оС and 1MHz | < 6.0 |
| 6 | Loss tangent at 20оС and 1MHzVolume resistivity at 20оС | < 0.01>109 Ohm.cm |
| 7 | Dielectric strength | >2 kV/mm |
| 8 | Heat conductivity | 1,6 W/(m.K) |
| 9 | Operating temperature range | from -50оС to +200оС |
It is used as a 2-component heat-conducting compound in electrical engineering and instrument making.
It is successfully used for sealing and heat removal from the winding to the body of the front parts of the stators of electric motors.
Organosilicon adhesive-sealant «ELASIL 137-83»
(TS 2252-164-00209013-2016)
«Elasil 137-83» it is a paste-like viscous-flow composition based on low molecular weight rubber, catalyst and fillers, vulcanized in contact with air moisture to form a rubbery material. Optimal performance is achieved by vulcanization in a relative humidity of 50-70% for 5 days.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | from white to light-gray |
| 2 | Dynamic viscosity at 20оС | 200-400 Pa.s |
| 3 | Skinning time at 20оС | >1h |
| 4 | Tensile strength | >2 MPa |
| 5 | Extension coefficient | >200% |
| 6 | Strength to metal, | |
| at peeling | >20 N/m | |
| when shifting | >1,6 MPa | |
| 7 | Dielectric permeability at 20оС and 1MHz | < 4,3 |
| 8 | Loss tangent at 20оС and 1MHz | < 0,02 |
| 9 | Volume resistivity at 20оС | >1013 Ohm.cm |
| 10 | Dielectric strength | >18 kV/mm |
| 11 | Heat conductivity | 0,6 W/(m.K) |
| 12 | Operating temperature range | from -60оС to +250оС |
It is designed for bonding and sealing parts made of steel, aluminum alloys, copper, ceramics, silicate glass, silicone rubber, for the formation of gaskets formed in flange, threaded and other compositions.
There is a positive experience of application in the field of heat power supply to exclude cold air infiltration from the environment through the looseness of the metal sheathing along the gas path from the furnace to the suction pipe of the flue-gas pump of power blocks’ boiler units, as well as to seal the vacuum system of turbines.
Organosilicon adhesive-sealants
«ELASIL 137-175М» (TS 6-02-1319-85)
«ELASIL 137-175М-1» (TS 2252-108-00209013-2012)
«Elasil 137-175M», «Elasil 137-175M-1» adhesive sealants are pasty viscous flow compositions based on low molecular rubber, catalyst and fillers curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard | |
| 137-175М | 137-175М-1 | ||
| 1 | Color | white | |
| 2 | Dynamic viscosity at 20оС | 80-100 Pa.s | |
| 3 | Pot life | ||
| at 17-27оС, | >1 h >2h | ||
| shear strength of | |||
| adhesive bond of | |||
| aluminum alloy D16АТ | |||
| at 20оС | >1.5 MPa | ||
| at 300оС | > 0.4MPa | ||
| 4 | Strength at uniformdetachment of bond jointof aluminum alloy D16AT at 20оС | >1 MPa | |
| 5 | Density | 1.5 g/cm3 | |
They are designed for bonding metals and non-metals, including heat-insulating ones, working in air, vacuum at temperatures up to 300 ° C (at 300 °C - 50 hours).
Adhesive sealants have a glass transition temperature of minus 108-110°C. When bonding the materials of the armored vehicles, the glue ensures the operability of the compound up to minus 130 °C.
Organosilicon adhesive sealant «ELASIL 137-180» grades A and B
(TS 20.52.10-278-00209013-2019)
«Elasil 137-180» is a one-part composition based on low molecular rubber, catalyst and special additives curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard | |
| Grade A | Grade B | ||
| 1 | Color | from colorless to light yellow | |
| 2 | Dynamic viscosity at 20оС | 1.6-2.0 Pa.s | 1.6-20.0 Pa.s |
| 3 | Skinning time at 20оС, | >3 h | |
| 4 | Tensile strength | >0.1 MPa | |
| 5 | Extension coefficient | >80% | |
| 6 | Dielectric permeability at 20оСand 1MHz | < 3.0 | |
| 7 | Loss tangent at 20оС and 1 MHz | < 0.01 | |
| 8 | Volume resistivity at 20оС Ohm*cm | >1014Ohm·cm | |
| 9 | Dielectric strength | >20 kV/mm | |
| 10 | Heat conductivity | 0.18 W/(m.K) | |
| 11 | Operating temperature range | from -80оС to +200оС | |
It is recommended as an optically transparent adhesive sealant for gluing and sealing optical systems, for surface sealing of stress-sensitive elements of electronic devices.
Organosilicon adhesive sealant «ELASIL 137-181»
(TS 20.52.10-206-00209013-2017)
(Constructional, low-modulus)
«Elasil 137-181» is a pasty thixotrop composition based on low molecular siloxane rubber, plasticiser, catalyst and fillers curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | white |
| 2 | Dynamic viscosity at 20оС | 800 - 1000 Pa.sec |
| 3 | Skinning time at 20оС | >30 h |
| 4 | Tensile strength | >0.8 MPa |
| 5 | Stretch ratio | > 500 % |
| 6 | Adhesive strength with metal | |
| at peel | >40 N/m | |
| at shear | > 1.6 MPa | |
| 7 | Dielectric permeability at 20оС and 1MHz | < 4.0 |
| 8 | Loss tangent at 20оС and 1MHz | < 0.005 |
| 9 | Volume resistivity at 20оС | >1012 Ohm·cm |
| 10 | Dielectric strength | >15 kV/mm |
| 11 | Heat conductivity | 0.4 W/m.K |
| 12 | Operating temperature range | from -45оС to +150оС |
It is designed for sealing concrete joints, including in large-panel building structures, parts made of steel, aluminum, glass, ceramics, as well as a protective coating of products made of the above materials in construction. There is a positive experience with the use of the sealant on the Moscow construction sites.
Organosilicon adhesive sealant «ELASIL 137-182»
(TS 6-02-1-015-89)
(Heat conductive)
«Elasil 137-182» is a pasty composition based on low molecular rubber, catalyst and fillers curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | grey |
| 2 | Dynamic viscosity at 20оС | 300-400 Pa.sec |
| 3 | Skinning time at 20оС | < 6 h |
| 4 | Tensile strength | >2 MPa |
| 5 | Stretch ratio | > 500 % |
| 6 | Adhesive strength with metalat shear | >1МPa |
| 7 | Dielectric permeability at 20оС and 1MHz | < 4.8 |
| 8 | Loss tangent at 20оС and 1MHz | < 0.009 |
| 9 | Volume resistivity at 20оС | >1011 Ohm.cm |
| 10 | Dielectric strength | >9 kV/mm |
| 11 | Heat conductivity | 1.6 – 1.8 W/(m.K) |
| 12 | Operating temperature range | from -60оС to +200оС |
It is designed for installation and mounting of radio electronic elements and integrated circuits in various branches of science and industry. Significantly improves the thermal modes of operation of devices and accessories.
When cured it is resistant to the action of solvents (gasoline, toluene, alcohol, acetone, etc.)
Organosilicon adhesive sealant «ELASIL 137-490»
(TS 2252-162-00209013-2016)
(Heat conductive)
«Elasil 137-182» is a pasty composition based on low molecular rubber, catalyst and fillers curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | grey |
| 2 | Dynamic viscosity at 20оС | 300-400 Pa.sec |
| 3 | Skinning time at 20оС | < 6 h |
| 4 | Tensile strength | >2 MPa |
| 5 | Stretch ratio | > 500 % |
| 6 | Adhesive strength with metalat shear | >1МPa |
| 7 | Dielectric permeability at 20оС and 1MHz | < 4.8 |
| 8 | Loss tangent at 20оС and 1MHz | < 0.009 |
| 9 | Volume resistivity at 20оС | >1011 Ohm.cm |
| 10 | Dielectric strength | >9 kV/mm |
| 11 | Heat conductivity | 2.5 – 3.0 W/(m.K) |
| 12 | Operating temperature range | from -60оС to +200оС |
It is designed for installation and mounting of radio electronic elements and integrated circuits in various branches of science and industry. Significantly improves the thermal modes of operation of devices and accessories.
When cured it is resistant to the action of solvents (gasoline, toluene, alcohol, acetone, etc.)
Organosilicon adhesive sealant «Elasil 137-242»
(TS 2252-153-00209013-2015)
(Heat conductive)
«Elasil 137-242» is a pasty 2-part composition based on low molecular rubber and fillers curing when mixed with vulcanization catalyst (К-68) with rubber-like material formation. Optimum parameters of curing are achieved at within 24 hours.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | grey |
| 2 | Dynamic viscosity at 20оС | 300-400 Pa.sec |
| 3 | Skinning time at 20оС | < 6 h |
| 4 | Tensile strength | >1.5 MPa |
| 5 | Stretch ratio | > 500 % |
| 6 | Adhesive strength with metalat shear | >1.4 МPa |
| 7 | Dielectric permittivity at 20оС and 1MHz | < 1.5 |
| 8 | Loss tangent at 20оС and 1MHz | < 0.005 |
| 9 | Volume resistivity at 20оС | >1011 Ohm.cm |
| 10 | Dielectric strength | >15 kV/mm |
| 11 | Heat conductivity | 1.6 W/(m.K) |
| 12 | Operating temperature range | from -60оС to +200оС |
It is used as 2-part heat conducting adhesive sealant to remove heat from the hot elements and electrical insulation in electronics, electrical engineering, instrument making and mechanical engineering in conditions of limited access of air.
Organosilicon adhesive sealant «ELASIL 137-352» Grades A, B, V, V-1, A-3
(TS 6-02-1-037-91)
«Elasil 137-352» is pasty viscous flow composition based on low molecular rubber, catalyst and fillers curing at air moisture contact with rubber-like material formation. Whereupon in grades A, B, B, B-1, acid-type vulcanization catalysts are used, and in grade A-3 - neutral type ones.
Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard | ||
| A/B | V/V-1 | A-3 | ||
| 1 | Color | white/black | translucent | white/black |
| 2 | Dynamic viscosity at 20оС | 200-300 | 150-350 | 200-300 |
| 3 | Skinning time at 20оС | < 1 | < 2 | < 1.5 |
| 4 | Tensile strength | > 1 | > 0.8 | > 0.7 |
| 5 | Extension coefficient, % | >100 | >120 | >120 |
| 6 | Bond strength with: | |||
| polycarbonate, polyamide | ||||
| at shear, MPa | >1.5 | - | >1.5 | |
| siliceous glass | ||||
| at tear, MPa | – | >2.0 | – | |
| 7 | Operating temperature range | from -60оС to +250оС | ||
Designed for bonding and sealing metal and non-metal surfaces. There is a positive experience of using «Elasil 137-352» of grades A, V, A-3 when gluing block clusters made of polycarbonate, polyamide and silicate glass. Operating capabilities are achieved in a day. Grades B and B-1 are successfully used for silicate glass – silicate glass bonding and silicate glass - metal parts bonding in prefabricated household electrical appliances, and can also be used in the manufacture and repair of aquariums, stained glass, etc.
Organosilicon adhesive sealant «ELASIL 137-481»
(TS 2252-057-00209013-2008)
(Funginert)
«Elasil 137-481» is a pasty thixotrop composition based on low molecular rubber, catalyst and fillers curing at air moisture contact with rubber-like material formation. Optimum parameters of curing are achieved at relative humidity of 50-70% within 5 days.
Technical characteristics:
| № | Parameter | Standard |
| 1 | Color | white |
| 2 | Dynamic viscosity at 20оС | 600 - 800 Pa.sec |
| 3 | Skinning time at 20оС | > 1 h |
| 4 | Tensile strength | >1.2 MPa |
| 5 | Stretch ratio | > 220 % |
| 6 | Adhesive strength with metal | |
| at peel | >20 N/m | |
| at shear | >1.0 MPa | |
| 7 | Dielectric permittivity at 20оС and 1MHz | < 4.3 |
| 8 | Loss tangent at 20оС and 1MHz | < 0.02 |
| 9 | Volume resistivity at 20оС | >1011 Ohm.cm |
| 10 | Dielectric strength | >10 kV/mm |
| 11 | Heat conductivity | 0.6 W/m.K |
| 12 | Operating temperature range | from -60оС to +250оС |
Single component funginert silicon RTV adhesive-sealant «Elasil 137-481» is designed for bonding, sealing and tightening of metals and nonmetals for products of industrial and household purposes used in high humidity conditions. First of all the adhesive-sealant is of high interest for the building organizations that perform sealing and tightening of the constructions, hygiene equipment etc. in high humidity conditions. Moreover, the material may attract various branches of industry (radio engineering, electronics, aircraft, shipbuilding etc.) as an adhesive sealant for products used in high humidity conditions.
Fungi resistance tests were held in FSUE SRC RF VIAM according to Industrial standard 9.049-91